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Submitted
Aug 5, 2020
Published
Sep 28, 2016
SIMULATION OF THERMAL STRAIN IN AlN CRYSTALLINE FILM GROWN ON A TRENCH-PATTERNED AlN/-Al2O3 TEMPLATE USING THE FINITE ELEMENT METHOD
Corresponding Author(s) : Dinh Thanh Khan
dtkhan@ued.udn.vn
UED Journal of Social Sciences, Humanities and Education,
Vol. 6 No. 3 (2016): UED JOURNAL OF SOCIAL SCIENCES, HUMANITIES AND EDUCATION
Abstract
Thermal strain that results from differences in thermal parameters between AlN and a-Al2O3 in an AlN crystalline film grown on a trench-patterned AlN/a-Al2O3 template has been simulated via the finite element method using the sotfware ANSYS. The simulation results show that the thermal strain is distributed in circulation along the direction in correspondence with the circulation of the trench-patterned structure of the AlN/a-Al2O3 template. The thermal strain reduces considerably around voids formed in crystalline AlN films due to the horizontal overgrowth of AlN crystals on the trench-paterned AlN/a-Al2O3 template. The simulation results clearly indicate that the use of trench-patterned templates has significantly reduced the thermal strain in crystalline films through the formation of voids.
Keywords
thermal strain; AlN crystalline film; ANSYS; finite element method; FEM.
Dinh Thanh Khan. (2016). SIMULATION OF THERMAL STRAIN IN AlN CRYSTALLINE FILM GROWN ON A TRENCH-PATTERNED AlN/-Al2O3 TEMPLATE USING THE FINITE ELEMENT METHOD. UED Journal of Social Sciences, Humanities and Education, 6(3), 17-21. https://doi.org/10.47393/jshe.v6i3.648
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